ETG.5001.6220 MDP IO-Link Master
EtherCAT Modular Device Profile Specification
Part 6220: IO-Link Master
The Modular Device Profile (MDP) defines a modelling of structures within in a device. Mainly the object dictionary structure and corresponding behaviour of the entries is defined by the MDP. The intention is to provide an easy way for master and configuration tools to handle the devices.
A modular structure can be used for all kind of devices that supports physical or logical modules. This can be for example:
- Gateways from Fieldbusses to EtherCAT
- Multi-axis servo drives (physical modules) with each axis having independent operation modes (logic modules)
- Extendable bus coupler with an internal backbone (e.g. sliced I/Os)
The ETG.5001-6220 describes the fieldbus integration of IO-Link. The IO-Link system defines the communication between sensors, actors and I/O devices which can be used as fieldbus devices in different fieldbus systems.
The ETG.5001-6220 V1.0.5.1 is available as a draft for review within ETG for six (6) weeks. The review period ends May 2, 2025. Please provide your comments to Mr. Rainer Hoffmann as mentioned in the comment form included in the ZIP file.
| 描述 | 语言 | 类别 | 日期 | 大小 | 版本 | 状态 | |
|---|---|---|---|---|---|---|---|
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ETG.5001.6220 MDP IO-Link Master Specification | EN | 2017年5月2日 | 0,44 MB | 1.0.5 | Release | |
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ETG.5001.6220 MDP IO-Link Master Specification | EN | ZIP | 2025年3月21日 | 0,40 MB | 1.0.5.1 | Draft for Review |
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