Hesse GmbH, founded in 1986 and based in Paderborn, Germany, develops and manufactures fully automatic ultrasonic and thermosonic wire bonders and ultrasonic flip chip bonders together with standard or customer-specific automation solutions for the backend semiconductor industry. Hesse GmbH is one of the world’s leading producers of wire bonders using the ultrasonic wedge-wedge and the thermosonic ball-wedge technology and develops customer-specific production processes. The core competencies of the company are mechatronic systems, ultrasonic technology, control engineering and the detailed understanding and knowledge of the processes and physical effects relevant in ultrasonic joining technology.