PACK EXPO International: ETG Booth
| Data: | 03.11.2024 - 06.11.2024 |
| Città, Paese: | Chicago (IL), USA |
| Luogo: | McCormick Place |
| Padiglione, Stand: | Lakeside Upper, 8045 |
| Tipo: | Fiera |
| Indirizzo web: | www.packexpointernational.com |
| Ulteriori informazioni: |
ETG participates in the PACK EXPO International, the world’s most comprehensive packaging and processing event this year. Visit our EtherCAT experts at booth LU-8045 from November 3 - 6! |