PACK EXPO International: ETG Booth

PACK EXPO International: ETG Booth

Date: Nov 03, 2024 - Nov 06, 2024
Location: Chicago (IL), USA
Venue: McCormick Place
Hall, Booth: Lakeside Upper, 8045
Type: Tradeshow
Web address: www.packexpointernational.com
Further information:

ETG participates in the PACK EXPO International, the world’s most comprehensive packaging and processing event this year. Visit our EtherCAT experts at booth LU-8045 from November 3 - 6!