PACK EXPO International: ETG Booth
Date: | Nov 03, 2024 - Nov 06, 2024 |
Location: | Chicago (IL), USA |
Venue: | McCormick Place |
Hall, Booth: | Lakeside Upper, 8045 |
Type: | Tradeshow |
Web address: | www.packexpointernational.com |
Further information: |
ETG participates in the PACK EXPO International, the world’s most comprehensive packaging and processing event this year. Visit our EtherCAT experts at booth LU-8045 from November 3 - 6! |