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ETG to participate at PACK EXPO International 2024 in Chicago
10/2024 | The EtherCAT Technology Group will be showcasing at PACK EXPO International 2024, the world's leading packaging and processing event.From November 3-6, 2024, visitors can meet ETG’s EtherCAT experts at McCormick Place, Chicago, in Lakeside Upper Hall, booth 8045. This event provides a key opportunity to explore EtherCAT's innovative solutions for the packaging and processing industry. Attendees can learn how EtherCAT technology enhances automation, efficiency, and precision in packaging processes.
